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Dynamic Thermal Simulation of Power Devices Operating with PWM Signals in a Three-Phase Inverter Drive System
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| Author(s) |
Zhongfu Zhou, Salah Khanniche, Nebojsa Jankovic, Stephen Batcup, Petar Igic |
| Abstract |
Fast power devices thermal simulation method
based on averaging power losses over each cycle of PWM
switching frequency is presented in this paper. For
implementing a long real time dynamic thermal simulation
of power devices, device power losses during transient
process and static characteristics are defined as a function
of device conduction current and junction temperature, and
are represented by a lookup table. By carrying out the
circuit electrical simulation, the device conduction current
can be obtained. By combining the device conduction
currents, global device temperature (GDT) and the data
from the lookup table, the average power loss over each
cycle of PWM switching frequency is then calculated for
carrying out the thermal simulation. With the proposed
method, a relative large simulation time step can be
employed and simulation speed can be increased
dramatically. The method is suitable for a long real time
thermal simulation for complex power electronics systems. |
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| Filename: | T2-411.pdf |
| Filesize: | 389.5 KB |
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| Type |
Members Only |
| Date |
Last modified 2007-03-13 by System |
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