| Abstract |
The Direct Bonded Copper (DBC) substrate technology is
widely used as the base material in power electronics. Due
to differences in Coefficient of Thermal Expansion (CTE) of
the materials used, the robustness to thermal cycling is
limited. This paper will deal with the fact, that the
supplier’s specification of thermal cycling performance
often is specified at a much larger temperature span, than
the temperatures actually present in a running application.
The aim is to supply the designers of power electronics with
some mean of evaluating the actual cycles to failure in a
given application. |
