Technologies are now available to embed circuit functionality into the printed circuit board (PCB) that is used to interconnect the various components of a power electronics converter. Technologies are presented for realizing capacitive, magnetic and resistive functions in a multilayer PCB. It is suggested that in planar magnetic cores be combined with ferroelectric capacitor sheets together with new surface mount components to enhance the reactive power capability of the passive components. Two case studies are presented illustrating the possibilities that the new technologies offer. The capacitance values needed for switchmode power conversion is analyzed and possibility to embed these capacitors in the PCB is investigated. Two factors that limit the power handling capability in low profile converters with embedded passive components are identified and analyzed, namely the ratio of PCB area to component area and role that the third dimension plays in planar converters.
| Filename: | EPE Journal 13-2 - 1 - Paper Ferreira |
| Filesize: | 467.3 KB |
