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Advanced DBC (Direct Bonded Copper) Substrates for High Power and High Voltage Electronics
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| Author(s) |
EXEL Karl; SCHUL |
| Abstract |
Direct bonded copper substrates have been proven for many years as an excellent solution for electrical isolation and thermal management of high power semiconductor modules. The advantages of DBC-substrates are high current carrying capability due to thick copper metallization and a thermal expansion close to the one of silicon at the copper surface due to high bond strength of copper to ceramic. Increasing requirements for thermal performance and partial discharge free behavior of high power modules were driving research to further improve DBC substrates. This paper will present recent developments of partial discharge free and liquid cooled substrates. |
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| Filename: | 0803 |
| Filesize: | 140.6 KB |
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| Type |
Members Only |
| Date |
Last modified 2006-02-05 by System |
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