| Abstract |
This paper presents new power chip concepts such as Reverse Conducting IGBT (RC-IGBT), which are integrated IGBT with Diode and Reverse Blocking IGBT (RB-IGBT). The RC-IGBT will have a big impact for conventional Power Modules. Because, by using RC-IGBT, we can save resources such as Silicon Chip (including material itself and production energy) and also save Packaging Materials. By using RB-IGBT, we will able to make new Power Control Systems such as AC Matrix Converter and thus eliminate the large DC link Capacitor. High Voltage IC (HVIC) is used already as simple gate drive circuit in low power area. By using HVIC, a single gate power supply is enough for driving all 6 inverter switches. This paper presents newest HVIC concept and structure. We are developing new module packaging concepts having a new thermal dissipation structure and using transfer-molded package. This allows us to reduce package size and weight. Consequently our newest package will save resources of packaging and logistics and energy of transport.The newest Power Module, whose key concept is called “Environmental Compatibility”, will be a combination of RC-IGBT (or RB-IGBT), HVIC and new packaging technologies in order to save resources. The Key Word ”Environmental Compatibility” is indicating our new Power Device’s Direction. |
