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Magnetic field distribution in embedded passive integrated circuits
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| Author(s) |
S. Schuh; M. Albach |
| Abstract |
The integration of passive components in printed circuit boards by using structured layers of different
material leads to completely new technical challenges, both in technological realisations and in simulations
or modelling of the embedded components. In this paper the influence of FPC foils (Ferrite
Polymer Compounds) on the magnetic field distribution and thus on the inductive coupling mechanisms
between several loops is analytically calculated and verified by measurements. |
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| Filename: | EPE2003-PP0010 - S. Schuh |
| Filesize: | 224.5 KB |
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| Type |
Members Only |
| Date |
Last modified 2003-10-13 by Unknown |
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