| |
Express - Method And Thermal Resistance Measurement Equipment
| [View]
[Download]
|
| Author(s) |
Valery M. Gartsbeyn, Sergey V. Ivanov, Nikolay F. Maramygin, Lubov V. Romanovskaya, Stanislav N. Florentsev |
| Abstract |
The express-method of thermal resistance
measurement in power semiconductor modules is submitted.
The method is based on continuous measurement of
semiconductor element (IGBT, FRD) temperature-dependent
parameter and temperature of the power module baseplate
whilst heating the semiconductor by a current up to Tjmax and
following compulsory cooling down to Ta. During the
subsequent calculations Rthjc and its components R0C0, R1C1,
R2C2 of thermal model are calculated for all layers in the
module: semiconductors chip - DCB-ceramics - baseplate. The
results of modeling by means of finite elements method are
described. The automated measurement equipment realizing the
developed method are presented. The results of calculations and
experiments are given, showing the matching of modeling
results and measurement by classical and developed expressmethod. |
| Download |
| Filename: | A15719 |
| Filesize: | 871.9 KB |
|
| Type |
Members Only |
| Date |
Last modified 2006-02-15 by System |
| |
 |