This paper presents the simulation and experimental results of a study concerning the thermal characterization of a high power rated IGBT (600 V - 400 A). A special measuring set-up has been mounted enabling the investigation of its static and dynamic behaviour by means of a thermosensitive parameter. The use of an infra-red camera has allowed a cartography of the temperature distribution within the active parts during operation to be established.
Two dimensional numeric simulation of the hybrid structure of the power component (by means of the finite element software FLUX 2D) has completed the delicate experimental investigations. These results, concerning both static and dynamic behaviour, aim at defining the validity limits of the approach.
Furthermore, a sensitivity study has been carried out in order to determine the incidence of different parameters upon the thermal resistance of the power device.
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