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Thermal Analysis of Packaged Power Devices
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| Author(s) |
P.E. Bagnoli; C. Casarosa; E. Dallago; G. Venchi |
| Abstract |
An application of the Thermal Resistance Analysis by Induced Transient (TRAIT) method to
simulated and real power device packages with a plastic covering is presented. The TRAIT method
allows the exact and physically consistent equivalent electrical circuit to be obtained if the thermal
system shows an unidirectional heat transfer. In the present case, because of the plastic layer, this
hypothesis had not been verified and improvements to the TRAIT analysis were necessary. Analysis
of simulated and experimental thermal transients are reported and discussed. |
| Download |
| Filename: | EPE1999 - PP00591 - Bagnoli.pdf |
| Filesize: | 1.633 MB |
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| Type |
Members Only |
| Date |
Last modified 2004-03-26 by System |
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