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Electrothermal Investigation on Large Power Components and Multichip Power Modules
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| Author(s) |
P. Tounsi; K. Bellil; J.-M. Dorkel |
| Abstract |
A simple on-state electrical model is associated with a true transient 3D heat equation solver
(LAASTHERM_T), intended to predict the transient temperature and current distributions in large power
components, when the waveform of the load current is known.
LAASTHERM_T computes transient temperature distributions over the whole active area of the module,
taking into account 3D heat diffusion effects in chips and their common package, using power
dissipation given by the electrical model. |
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| Filename: | EPE1999 - PP00529 - Tounsi.pdf |
| Filesize: | 138.1 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-03-26 by System |
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