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Current and Temperature Distribution in Multi-Chip Modules under Inverter Operation
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| Author(s) |
T. Franke; G. Zaiser; J. Otto; M. Honsberg-Riedl; R. Sommer |
| Abstract |
The paper contains the results of investigations on high voltage IGBT modules actual working in an
inverter for traction applications and presents a new approach for the thermal analysis of multichip
assemblies. For this, electrical parameters of the system as well as module currents, chip temperatures
and their transient behaviour have been monitored under different driving and cooling conditions of the
inverter. A specially prepared IGBT-module has been used to investigate the module-inverter interplay.
The measured data have been analyzed in detail to separate the different effects which cause a varying
temperature distribution. It is pointed out that the well-known temperature redistribution by varying
current sharing is dominated significantly by the mutual thermal influence between the IGBT and diode
chips. For this purpose a model which is based on the principle of superposition has been built up
describing the thermal interference inside the module. Finally, the results are discussed under aspects of
reliability pointing out that the mutual thermal influence between several chips of a multichip module
can be used as a sensitive measure for the quality of the interface between the module and the heatsink. |
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| Filename: | EPE1999 - PP00367 - Franke.pdf |
| Filesize: | 156.7 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-03-26 by System |
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