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Design Concepts of a Bondless Pressure Contact IGBT
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Author(s) |
M. Evans; F. J. Wakeman; R. I. Irons; G. W. Lockwood; K. R. Billett |
Abstract |
The mechanical construction and characteristics of a new 400A, 1800V bondless pressure contact
IGBT are presented. Details of the design philosophy used in the bondless pressure contact device are
reviewed, with special emphasis being given to the electrothermal characteristics, which are both
modelled and compared to a substrate mounted design. Some consideration is given to optimising
devices for specific applications. |
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Filename: | EPE1999 - PP00594 - Evans.pdf |
Filesize: | 316.1 KB |
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Type |
Members Only |
Date |
Last modified 2004-03-25 by System |
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