Please enter the words you want to search for:

[Return to folder listing]

   Design Concepts of a Bondless Pressure Contact IGBT   [View] 
 [Download] 
 Author(s)   M. Evans; F. J. Wakeman; R. I. Irons; G. W. Lockwood; K. R. Billett 
 Abstract   The mechanical construction and characteristics of a new 400A, 1800V bondless pressure contact IGBT are presented. Details of the design philosophy used in the bondless pressure contact device are reviewed, with special emphasis being given to the electrothermal characteristics, which are both modelled and compared to a substrate mounted design. Some consideration is given to optimising devices for specific applications. 
 Download 
Filename:EPE1999 - PP00594 - Evans.pdf
Filesize:316.1 KB
 Type   Members Only 
 Date   Last modified 2004-03-25 by System