| Abstract |
We have studied a new technique for the realisation of inductive devices with an enhanced electrical quality factor. the technique consists in the etching and subsequent electroplating of Cu coils with very high Cu filling, typically leading to a doubling of the quality factor, when compared to a non-electroplated sample. We have extensively characterised the geometrical properties of the coil winding patterns as a function of electroplating current and have measured the inductance, Ohmic resistance and quality factor versus frequency. The method works well below frequencies of about 0.1 - 1 MHz; at higher frequencies, both eddy current losses and capacitive coupling lead to a decreasing quality factor for the electroplated devices. |
