| Abstract |
Since 1994, the technology of the high power IGBT modules for traction inverter was improved a lot. The first technology weakness identified was the bonding attach reliability. The second failure mode is the cracking of the solder layer between base plate material and ceramic plate. The topic proposed concerns the power cycling behavior of the packaging technology using new base plate material named AISiC, to replace the usual copper base plate. The results of this accelerated tests show a high improvement, the lifetime before critical solder layer delamination is increased by a factor of six to ten, according to our test results. Test conditions, methodology of measurement mainly considering thermal resistance interpretation, thermal simulation and failures analysis are discussed. |
