Please enter the words you want to search for:

[Return to folder listing]

   A Punch-Through IGBT Model Using a Simple Technological Parameters Extraction Method for Two-Dimensional Physical Simulation   [View] 
 [Download] 
 Author(s)   S. Azzopardi; M. Trivedi; C. Zardini; K. Shenai 
 Abstract   The two-dimensional (2-D) physically-based simulation of power devices gives lots of information about the dynamic mechanisms which allow to understand the behavior of the devices. But it requires a lot of technological parameters such as doping, dimension, carrier lifetime of the various layers. Various destructive analysis methods are available, but they do not allow to keep the device intact. In this paper, we propose a physical model for Punch-Through IGBT obtained by using a non destructive parameters extraction method based on simple electrical measurements. Then, most of the technological parameters can be evaluated. To verify the accuracy of these extracted parameters, a 2- D IGBT structure is implemented in a 2-D physically-based simulator using the finite element method. The good matching between simulated and experimental results allows to validate this parameters extraction method. 
 Download 
Filename:EPE1999 - PP00269 - Azzopardi.pdf
Filesize:87.11 KB
 Type   Members Only 
 Date   Last modified 2004-04-01 by System