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Two copper layer Insulated Metal Substrate PCB potential using Wide-Bandgap semiconductors
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| Author(s) |
Macia CAPO-LLITERAS, Pau MORENO-RUBIO, Daniel HEREDERO-PERIS, Daniel MONTESINOS-MIRACLE |
| Abstract |
This paper evaluates two copper-layer Insulated Metal Substrate (IMS) PCBs for power converters, highlighting reduced parasitic inductance and strong thermal performance. It compares various layouts, considering parasitic capacitance, inductance, thermal resistance, and power density, demonstrating exceptional performance in a 4 kVA half-bridge with a 400 V dc-link design. |
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| Filename: | 0001-epe2025-full-14380996.pdf |
| Filesize: | 2.914 MB |
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| Type |
Members Only |
| Date |
Last modified 2025-08-31 by System |
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