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   Low inductance power module optimized for Flying Capacitor Topology   [View] 
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 Author(s)   Philippe LASSERRE, Cyrille DUCHESNE, Anusha GOPISHETTI 
 Abstract   In Renewable Energy domain, power converter require adapted solutions to increase electrothermal performances. In this paper, a high-performance packaging architecture is proposed, dedicated to a flying capacitor topology. Based on 750V SiC bare dies, interconnection technologies, materials and optimized design was established to obtain a dedicated power module, with the support of finite element modeling. A specific assembly process was developed with innovative tooling and was tested at the end of process by electrical static tests and Xray analysis. Power electrical performances was measured by double pulse test method. Electrical characterization and module simulation recovered the value of inductance close to 6nH. Next step is to evaluate the robustness of this new power module with campaigns of passive temperature cycling and power cycling to be performed. 
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Filename:0029-epe2025-full-17375430.pdf
Filesize:1.394 MB
 Type   Members Only 
 Date   Last modified 2025-08-31 by System