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A method for detecting the start of delamination at the corners of solder joint in a 3D PCB Integration Assembly of MOSFET SiC
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| Author(s) |
Souhila BOUZERD, Laurent DUPONT |
| Abstract |
The article discusses a method for evaluating the delamination initiation at solder joint corners in a 3D assembly of SiC MOSFETs integrated into a PCB substrate to design a half bridge. This assembly leads to soldering two metallic materials and addresses the integration of small active chips with larger heat-sinks. This technological development is part of the perspective of evaluating the robustness of a new assembly model for wide band Gap components. This assembly consists of metallic base-plate corresponding to the heat-sink soldered on the copper foil of a PCB substrate. Conventional methods fail to detect delamination initiation effectively due to the optimized commutation cell design. Finite element simulations are carried out to assess the sensitivity of another method. Then, prototypes with controlled delamination rate are developed. The results demonstrate that electrical method is sensitive to detect the low delimitation rates comparing to thermal method. |
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| Filename: | 0109-epe2025-full-09384097.pdf |
| Filesize: | 632.9 KB |
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| Type |
Members Only |
| Date |
Last modified 2025-08-31 by System |
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