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Thermal cycling characterization of integrated GaN power module
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| Author(s) |
Zhongchao SUN, Masaki TAKAHASHI, Stig MUNK-NIELSEN, Asger Bjørn JØRGENSEN |
| Abstract |
A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation. |
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| Filename: | 0024-epe2023-full-12503063.pdf |
| Filesize: | 4.157 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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