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Improving Power Cycle Lifetime of SiC Power Modules with Double-Bonded Wire: Experimental and Simulation Analysis
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| Author(s) |
Enyao XIANG, Haoze LUO, Huan YANG, Xiangning HE, Naoto FUJISHIMA, Haruhiko NISHIO, Hitoshi SUMIDA |
| Abstract |
The trend of using silicon carbide power modules is driven by applications in traction, electric vehicles, and renewable energy generation. However, higher power density and temperature pose more severe challenges to the reliability of wire bonds in the package. This paper investigates the effects of geometric parameters on wire bond reliability through a comparison of single and double bonds and finds that double bonding can significantly enhance the thermal-mechanical performance of bonding wire. |
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| Filename: | 0358-epe2023-full-14054191.pdf |
| Filesize: | 3.984 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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