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Analysis of inhomogeneous temperature distribution in power modules for different cooling systems and the influence on lifetime consumption
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Author(s) |
Michael GLEISSNER, Mark-M. BAKRAN |
Abstract |
The temperature distribution in an IGBT module with 24 parallel chips is examined using an infrared temperature camera. Water and air cooling have different temperature distributions, but the difference between the hottest and coldest chips are similar at an equal mean temperature of all chips. The variation of the forward characteristic of the individual chips only has a minor influence on the temperature distribution. |
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Filename: | 0116-epe2023-full-14465751.pdf |
Filesize: | 2.53 MB |
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Type |
Members Only |
Date |
Last modified 2023-09-24 by System |
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