| Abstract |
Next generation SiC-MOSFET power modules for electric vehicle applications are targeting increased power density and efficiency to reduce the overall drivetrain and charger cost. High currents, fast switching transients as well as high power density packages demand: best use of semiconductor area by advanced bonding, cooling technologies and layout optimization. This presentation will give an overview of state-of-the-art of Semikron Danfoss power modules packaging, latest development in current sensing integration and some examples of high power density converter design with focus on SiC-MOSFET for E-Mobility applications. |
