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A High Power Density SiC MOSFET Inverter Design and Thermal Validation for EV Traction Application
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| Author(s) |
Kaushik MIRDODDI, Gopikrishnan K, Abhrodip CHAUDHURY, Soumya Shubhra NAG, Sumit Kumar PRAMANICK, Anandarup DAS, Mike MORIANZ, Gerald WEIS, Thomas KOECK, Johannes STAHR, Guenther MAIER |
| Abstract |
This paper addresses the design procedures and challenges of developing compact, high-density inverters by fabricating a half-bridge module using PCB embedded technology. The modules are constructed by placing 1.2 kV, 100 A MOSFET dies in the inner layers of the PCB, and the electrical connection for the dies is achieved using copper layers and micro-vias. The electrothermal analysis performed using ANSYS Electromagnetic suite demonstrates a low parasitic power loop inductanceof 4.25 nH and a junction temperature of less than 140 _C, indicating the efficacy of the design. A thermal test bench was set up, to validate the thermal simulation results. |
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| Filename: | 0576-epe2023-full-19534791.pdf |
| Filesize: | 4.554 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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