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Temperature Distribution of an IGBT Chip during Repetitive Switching Events under Consideration of Front-Side Ageing
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| Author(s) |
Christian BAEUMLER |
| Abstract |
Ageing effects are considered to provoke an inhomogeneous current distribution within power devices. The resulting temperature distribution at the junction and the surface of an IGBT chip was investigated in detail at different ageing states and for different switching frequencies during repetitive hard-switching events. Furthermore, the limitations of utilized methods for temperature determination were discussed. The observations were judged with respect to reliability issues. |
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| Filename: | 0244-epe2022-full-14090286.pdf |
| Filesize: | 1.102 MB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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