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   Novel Analytical Method for Estimating the Junction-to-Top Thermal Resistance of Power MOSFETs   [View] 
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 Author(s)   José Miguel SANZ-ALCAINE 
 Abstract   This papers proposes a new methodology for estimating the thermal resistance from the junction-to-topcapsule surface. By placing the transistor in a vertical position, without being soldered to any PCB, andsensing the dissipated power and the temperatures of the device, it is possible to characterize the internal thermal resistance. 
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Filename:0532-epe2022-full-14260486.pdf
Filesize:3.182 MB
 Type   Members Only 
 Date   Last modified 2023-09-24 by System