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Hybrid circuit board structure for power electronics
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| Author(s) |
Gerrit BRAUN |
| Abstract |
The objective of this paper is to show a novel approach for integrating GaN semiconductors as a discrete SMD component using an additional printed circuit board (PCB) for the power electronics of a PV inverter. This additional PCB is designed as an integrated metal substrate (IMS) circuit board to conduct the dissipated heat from the semiconductor into the heat sink. The IMS board is soldered with a BGA connection to a larger mother board. Therefore, usual production steps of electronics production are used to make the structure as simple as possible. |
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| Filename: | 0309-epe2022-full-10533557.pdf |
| Filesize: | 719.3 KB |
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| Type |
Members Only |
| Date |
Last modified 2023-09-24 by System |
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