| Abstract |
The talk will discuss the performance opportunities and technology challenges through the emergence of heterogeneous integration of power converters (including power management ICs, power switches, magnetics and capacitors) into processor packages using PCBembedding, 2.5D or even 3D packaging concepts to deliver significant system-level energy savings. This talk will discuss the impact of the commercial emergence, of magnetics-on-silicon technology and associated PCB-embedded magnetics technologies which are enabling Power Supply on Chip and Power Supply in Package platforms. These technologies, along with integrated high density capacitor technologies, PMICs and power switches, are central to the ongoing development of the concept of integrated, granular power for multi-coremicroprocessors and other complex system-on-chip (SOC) platforms. |
