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   Advanced Low-Voltage System-in-Package Half-Bridge MOSFET with Added Protection Features   [View] 
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 Author(s)   Salvatore MUSUMECI 
 Abstract   This paper deals with a smart System in Package (SiP) synchronous MOSFET half-bridge with internal current and thermal sensing circuits devoted to low-voltage supplies for autonomous driving applications. This kind of advanced application requests that Buck, Boost, or Buck-Boost converters can supply and stabilize the voltage. Furthermore, the temperature and the load current must be continuously monitored and controlled to increase the system's reliability. The SiP half-bridge described is experimentally evaluated in a Buck converter operation. Finally, a Buck interleaved configuration to improve the output current ripple and increase the current fed is experimentally investigated. The experimental results investigation demonstrates the effectiveness of the proposed SiP integrated half-bridge solution for an enhanced and reliable low voltage power supply. 
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Filename:0272-epe2022-full-23062635.pdf
Filesize:985.6 KB
 Type   Members Only 
 Date   Last modified 2023-09-24 by System