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Perceptibility comparison of degraded thermal parameters of a power module by junction temperature measurement via the internal gate resistance and forward volt
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| Author(s) |
Michael GLEISSNER |
| Abstract |
The thermal impedance of power modules is an end-of-life indicator because it increases due to materialdegradation. It can be determined by measurement of the junction temperature based on sensitiveelectrical parameters like the internal gate resistor or the forward voltage. The different results of bothmeasurement methods concerning the temperature measurement position are shown for power cycledsingle-chip IGBT modules with homogeneous and inhomogeneous temperature distribution. |
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| Filename: | 0143-epe2021-full-13275102.pdf |
| Filesize: | 3.025 MB |
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| Type |
Members Only |
| Date |
Last modified 2022-03-15 by System |
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