| Abstract |
The paper refers on the technical aspects and performances of a new cooling system based on two-phase free convection heat transfer of dielectric liquids. The new technology, wich foresees the immersion of the electronic subassemblies in the liquid pool or alternatively the use of cooling block, takes advantage of the two-phase thermosyphon principle. This permits the full utilization of the current handling capability of thyristors with largest diameter of the silicon wafer, maintaining an external air cooling solution and guaranteeing a very compact design. In the near future it is foreseen to adopt this cooling method in low and medium voltage large power converters for example for AC and DC drives and for static var compensators. |
