| Abstract |
For THOMSON HYBRID IC's, the development of a "Power Hybrid" die has become a major axis of development. This new branch has provided a complementary solution for the range of available techniques for miniaturisation of electronic equipment. Many manufacturers have found it necessary to reduce the volume of power stages for electronic systems. These stages exist in all types of equipment, forming a type of "Energy processing chain". Their role is energy commutation from source to commutation units. Over many years, there has been a tenfold increase in performance for power components and associated circuits (control, amplifier, interface, etc...), which have become preciser and more complex. In this field, attempts at miniaturisation are highly limited by mechanical and thermal constraints (casings, cooling, insultation, etc...) and the wide range of uses. Today, THOMSON Power Hybrids enable coexistence of both power semiconductors and associated electronics, insulated from one another within a single casing. The range extends from 1 to 10 A, or up to 60 W. Where the main aim is miniaturisation, the advantages gained from the power hybrid extend beyond hybrid electronics, as mechanical and thermal design of the equipment is facilitated. |
