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   1Chip Process of LDMOS and BiCMOS used for Battery Charger IC   [View] 
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 Author(s)   C. K. Jeon; J. J. Kim; Y. S. Choi; M. H. Kim; S. L. Kim; H. S. Kang; C. S. Song 
 Abstract   High Voltage LDMOS and control circuits have been integrated on the same chip which is a newly proposed 1-chip process for smart power IC with no epi. layer. This paper describes a uniquely designed layout and process architecture. When compared to 700V sustaining voltage and 0.55§Ùcm2 Ron,sp in conventional layout, the proposed LDMOS structure shows low specific on-resistance of 0.37§Ùcm2 and high breakdown voltage of 800V. And the method of effective ESD protection in LDMOS with senseFET was proposed. 
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Filename:EPE2001 - PP00180 - Jeon.pdf
Filesize:1.271 MB
 Type   Members Only 
 Date   Last modified 2004-03-10 by System