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Improved power chip electrical connection
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| Author(s) |
B. Boursat; F. Breit; M. Mermet-Guyennet |
| Abstract |
A new chip connection technique is developed to increase hybrid power module reliability.
It is well known that wire bonding is an important failure cause. This paper describes how to realise
the chip connections using solder balls, called bumps. And this new technique gives a large flexibility
for new packaging design. |
| Download |
| Filename: | EPE2001 - PP00657 - Breit.pdf |
| Filesize: | 62.83 KB |
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| Type |
Members Only |
| Date |
Last modified 2004-03-10 by System |
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