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   Jet impingement cooling for power IGBT chip   [View] 
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 Author(s)   E. Dutarde; M. Mermet-Guyennet 
 Abstract   A jet impingement cooling is studied in order to cool down power IGBT chip. First, the heat transfer is calculated via empirical correlation, then the set-up is simulated on a CFD code in order to take into account specific geometry of power devices. Finally, a prototype is manufactured to check the accuracy of calculation method. 
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Filename:EPE2001 - PP00590 - Meysenc.pdf
Filesize:243.8 KB
 Type   Members Only 
 Date   Last modified 2004-03-10 by System