| Abstract |
Diamond and diamond-like carbons (DLCs) possess the unique combination of excellent thermal conduction,
electrical insulation, and mechanical properties that make them candidate materials of choice for power
packaging applications (specifically those requiring high-performance thermal management solutions). This
paper discusses the advantages of utilizing diamond and DLC substrate technology in power packaging
applications, including: DLC processing issues, the results of experimental testing of preliminary diamond
power packages (in comparison with analytical and 3-D FLOTHERM computer simulations), and the analysis
of current prototype diamond power package designs and models. |
