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Wire bonding failure signature using high frequency characterization
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| Author(s) |
Stéphane BAFFREAU |
| Abstract |
This study deals with electromagnetic characterization of power electronic modules wire bonding failure. The several steps of the characterization method in order to reveal high frequency signature, are detailed. The application of the method is illustrated on isolated prototype. Simulation and experimental results highlight the same signature of the failure. |
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| Filename: | 0271-epe2019-full-09164529.pdf |
| Filesize: | 633.8 KB |
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| Type |
Members Only |
| Date |
Last modified 2020-08-14 by System |
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