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Power module platform for automotive reliability requirements
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| Author(s) |
Niko PAVLICEK |
| Abstract |
This paper presents the design and reliability assessments of a novel power semiconductor module platform for the automotive powertrain. Solder-free interconnects enable superior reliability meeting future automotive requirements. Modules with heavy Cu wire bonding on sintered top plates show a strongly improved power cycling lifetime compared to standard Al wire bonding. However, new failure modes are observed for the fully sintered devices. |
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| Filename: | 0041-epe2019-full-09532378.pdf |
| Filesize: | 1.529 MB |
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| Type |
Members Only |
| Date |
Last modified 2020-08-14 by System |
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