| Abstract |
High power Modular Multilevel Converters (MMC) have become key components for many future application fields, particularly, the efficient use of solar and wind power resources and improvement of grid infrastructure (i.e.: multi-terminal HVDC- and MVDC-networks). Further reduction of power losses, capacitor size and footprint of the converters are important issues. Fully electronic failure management and protection are additional important requirements. Main drivers of progress are improved semiconductors (Si and SiC) combined with advanced submodule topologies. The most promising combinations of submodule and semiconductors are investigated and compared by analytical methods - providing general insight. The results clearly show, that essential reduction of power losses and capacitor size are achievable - in addition to fully electronic protection and failure management. |
