| Abstract |
The advent of Wide-Bandgap (WBG) semiconductors, e.g., Silicon Carbide (SiC) and Gallium Nitride (GaN), power electronics E-drive converters are projected to obtain an increase in power density as ~2xfor SiC devices and ~4x for GaN devices, which demand detailed thermal modeling and analysis ofpower semiconductors and cooling systems. This paper has proposed high-fidelity (HiFi) modeling ofbidirectional DC-DC converter coupled with liquid cooling system providing detailed information withhigher accuracy and less complexity to determine performance during conceptual modeling in electricvehicle drivetrain with minimum testing and development effort. |
