Please enter the words you want to search for:

[Return to folder listing]

   Enhancement of Thermo-mechanical Behavior of IGBT Modules through Engineered Threshold Voltages   [View] 
 [Download] 
 Author(s)   Mohsen AKBARI 
 Abstract   In this paper, a purposely-imbalanced current density distribution in insulated-gate bipolar transistor(IGBT) chips is introduced to reduce the surface temperature inhomogeneity of standard chipstechnology. The idea is implemented by modifying the gate threshold voltage across the active chiparea, to counteract the uneven temperature distribution of a standard IGBT chip. Coupled thermomechanical analysis realized by finite element method (FEM) is used for validating the engineered IGBT chip via comparing different layouts. 
 Download 
Filename:0413-epe2019-full-15224148.pdf
Filesize:668.2 KB
 Type   Members Only 
 Date   Last modified 2020-08-14 by System