| Abstract |
Typically, power modules are mounted directly on a heat sink and either air or water cooled,therefore the main heat dissipation path is via the baseplate. New semiconductor materials areemerging which allow higher blocking voltages and thus make the housing assembly to agreater challenge. For these reasons, the idea of direct oil cooling and thus the replacement ofsilicone encapsulation is taken up again. A comparison between oil cooling and water coolingat measurement of the thermal impedance Zth is presented. |
