| Abstract |
In this paper a novel manufacturing technique is investigated with the aim of integrating magnetic components (e.g. inductors and transformer) on power module substrates together with the switching devices, to minimize overall dimensions and improve thermal management. The proposed approach consists of bonding copper U-shapes, representative of individual turn of the windings, onto the substrate. This offers an enhanced thermal exchange between the inductors and the cooling system and hence an increase in the current density. |
