| Abstract |
The high effective thermal conductivity of a heat pipe enables heat to be transferred at high efficiency over considerable distances. For instance, for high power device within a module containing other temperature sensitive components, heat pipe connects the heat sources directly to the heat sink without temperature increasing of the other components. On the other hand, heat pipe could be used for temperature flattening in a electronic system. A heat pipe is a high thermal conductance device in which a liquid is in equilibrium with its vapor. In the evaporation area the device is cooled and in condenser the heat is evacuated to the sink ; the liquid goes from condenser to evaporator by gravity or capillary force. Now for industrial applications, XERAM have developped a large range of heat pipes for high power components cooling : with water of organic fluids as working fluid. The thermal resistance for those devices is as low as 40 to 50° K.Kw-1, and depends of air speed cooling flow and also of total power applied to the evaporator. |
