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POWER ELECTRONIC SIMULATION USING BOND GRAPHS AND TRANSMISSION LINE MOOELLING
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| Author(s) |
G. M. Asher; W. F. Ray; V. Eslamdoost |
| Abstract |
This paper reports on a novel power electronic circuit simulation package incorporating two new techniques. The first is the use of Bond Graphs for the efficient and flexible formulation of equation structure by means of the Junction Structure Matrix. The second is the Transmission Line Modelling (TLM) technique which provides the capabilities for last stable solution of the equations. Brief summaries of the concepts are given. The package implementation of the TLM algorithm is described and validated wlth a modeling study of 3 phase bridge feeding a capacitor load. The use of the techniques for a generalized package Is discussed. |
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| Filename: | Unnamed file |
| Filesize: | 2.79 MB |
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| Type |
Members Only |
| Date |
Last modified 2019-07-19 by System |
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