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High Power Schottky Module Design Improves Effeciency And Reliability
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| Author(s) |
Sam Anderson; William C. Roman; Jarvis Carter |
| Abstract |
Improving the overall ruggedness of high current Schottky Rectifiers both to electrical and mechanical sources of stress is highly desirable. The electrical ruggedness performance can be achieved by designing for controlled avalanche energy capability. The mechanical ruggedness may be achieved by understanding the sources of stress transferred to the silicon chip housed in the package and optimization of package design to reduce the total stress transferred to the silicon from the application via the packaging material. Also reduction in any sources of variation in the manufacturing process that may induce internal stresses from the package is also considered in this paper. |
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| Filename: | Unnamed file |
| Filesize: | 2.435 MB |
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| Type |
Members Only |
| Date |
Last modified 2019-07-17 by System |
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