| Filename: | Unnamed file |
| Filesize: | 2.124 MB |
| THERMAL IMPEDANCE OF A POWER PLASTIC-PACKAGE | ||||||
| Author(s) | C. Casarosa; P. Di Barba; A. Savini; G. Ferla; A. Galluzzo; M. Mangiagli | |||||
| Abstract | The thermal model of a new plastic-package is presented, with the aim of interpreting experimental results in terms of transient thermal impedance. The model is able to explain, in particular, the dispersion of experimental data which has been observed for a set of real-life samples during the first part of the thermal transient. Such a dispersion is attributed to the presence of voids, due to manufacturing defects, in the soldering layer between die and frame. | |||||
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| Type | Members Only | |||||
| Date | Last modified 2019-07-17 by System | |||||
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