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DEVELOPING A TRUE 3D TRANSIENT THERMAL MODEL FOR POWER COMPONENTS OR HYBRID POWER CIRCUITS
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| Author(s) |
A. Napieralski; S. Tounsi; J. M. Dorkel; Ph. Leturcq |
| Abstract |
This paper shortly recalls the basic theory of the "Thermal Influence Coefficient" method especially intended for fast thermal C.A.D. of power components or hybrid circuits. The on-going software development is presented and an application example is given. The principle of the extension of the method to time-dependent power dissipation problems is then outlined and some examples of computations are also presented. The method presented in this paper allows to compute 3D transient thermal responses on PC computers and does not necessitate prohibitive running times . So, this method is suitable for efficient and low cost thermal C.A.D. |
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| Filename: | Unnamed file |
| Filesize: | 3.133 MB |
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| Type |
Members Only |
| Date |
Last modified 2019-06-11 by System |
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