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   Thermal performance analysis of GaN-based high-power converters   [View] 
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 Author(s)   Ander AVILA 
 Abstract   Gallium Nitride (GaN) devices are game-changing power electronics due to low conduction and switchingpower loss characteristics. However, their small size brings up new cooling challenges for its implementation in high-power converters. This paper compares thermal performance of different coolingconfigurations, looking for the optimal cooling solution to develop compact power converters based onGaN devices. The proposed thermal analysis and performance comparison are experimentally validatedcomparing top and bottom side cooling solutions. 
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Filename:0397-epe2018-full-21082578.pdf
Filesize:2.994 MB
 Type   Members Only 
 Date   Last modified 2019-05-05 by System