| Abstract |
The miniaturization of power converters, and the enhancement of their performances are one of the major challenges in today's power electronic community. At CEA, we are working on integration of active (GaN/Si, GaN IC) and passive (planar transformers, inductors, embedded capacitor) components. Packaging architecture leading to a better integration, and enhanced topologies providing better efficiencies are in the spectra of our roadmap as well. The need for miniaturization and access to better yield are especially addressing the consumer electronic, as for example USB type C power delivery application.The first part of this document is an introduction that highlight the technical challenges and targets of our work. Then, we are focusing on development of ferrite material. Our goal is to design and build proof of concept of a planar core implemented in a printed circuit board. The prototyping of ultra-thin integrated transformer is presented as well as its implementation in a LLC type converter. In this document, we will present the results of measurements; both electrical and thermal measurements will be shown and discussed. |
