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High temperature polyimide polymer material for high voltage IGBT power module switching applications
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| Author(s) |
Muhammad MORSHED |
| Abstract |
This paper focuses on the prevention of partial discharge (PD) at the edge of the nickel coated Cu-ceramicinterface of 6.5 kV IGBT substrates due to high electric field effects. A high temperaturepolyimide has been used to enhance the PD capability. The addition of silane coupling agents to thepolyimide has improved the bond strength to metal and ceramic surfaces thereby enhancing thestructures PD resistance. |
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| Filename: | 0096-epe2018-full-09352306.pdf |
| Filesize: | 1.685 MB |
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| Type |
Members Only |
| Date |
Last modified 2019-05-05 by System |
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